XL-524SURSYGC is a red-yellowish green bicolor through-hole LED in F5 package (diameter 5.9 mm, height 8.6 mm, lead length 28 mm). It features clear resin and a long-lead design for easy panel mounting or manual soldering, with a non-polar (bipolar) pin configuration that requires no polarity identification.
RoHS compliant with Moisture Sensitivity Level (MSL) 2. It offers low power consumption, long service life and high reliability, with a narrow 30° viewing angle (focused type).
Compared with the F3 version, the F5 package provides a larger emitting area and better heat dissipation, making it suitable for applications requiring a larger light-emitting size or higher reliability.
Optical Characteristics
Red Chip
Dominant Wavelength (λd): 625~645 nm (typical peak: 630 nm, slightly orange-red)
Luminous Intensity (IV): 50~400 mcd (@20 mA, see datasheet for binning details)
Yellowish-Green Chip
Dominant Wavelength (λd): 560~575 nm (typical peak: 570 nm)
Luminous Intensity (IV): 100~500 mcd (@20 mA, see datasheet for binning details)
Viewing Angle (2θ₁/₂): 30°
(Ultra-narrow angle with highly concentrated light output)
Electrical Parameters (Ta=25°C)
Red Chip
Maximum Power Dissipation: 50 mW
Maximum Continuous Forward Current: 20 mA
Forward Voltage: 1.8~2.4 V (@20 mA)
Yellowish-Green Chip
Maximum Power Dissipation: 50 mW
Maximum Continuous Forward Current: 20 mA
Forward Voltage: 1.8~2.4 V (@20 mA)
Maximum Pulse Peak Forward Current (IFP): 80 mA (Pulse width ≤0.1 ms, Duty cycle ≤1/10)
Reverse Current (IR): ≤10 μA (VR=5 V)
ESD Withstand Capacity: <1000 V (Human Body Model, HBM); ≤100 V (Machine Model, MM). Enhanced electrostatic protection is required during handling.
Structure & Reliability
Non-polar (bipolar) structure: Two LED chips connected in anti-parallel internally; no polarity identification required.
Operating Temperature: -20℃ ~ +85℃
Storage Temperature: -40℃ ~ +85℃
Soldering Conditions: Wave soldering at 240℃, ≤6 s; Manual soldering at 300℃, ≤3 s. Solder joints shall be more than 2.0 mm away from the base of resin body.
Lead bending must be performed more than 2.0 mm away from the base of resin body using fixtures.
Passed reliability tests including 1000-hour operating life, high-temperature high-humidity test and temperature cycling test (See Page 6 for details).
Additional Information
Available with brightness, voltage and wavelength binning to ensure consistent mass selection
Standard tape packaging with moisture-proof anti-static bags
28 mm lead length, suitable for panel mounting and manual soldering
Backlight Modules: Indicator lamps, signal backlighting (F5 package features larger emitting area for uniform backlight)
Automotive Interior: Dashboard indicators, key backlighting (F5 size is more suitable for automotive-grade applications)
Signal Indication: Equipment status indication, alarm lamps (focused beam ideal for long-distance observation; F5 size offers higher visibility)
Smart Home: Household appliance indicators, control panels
General Lighting: Decorative lighting, accent lighting (larger F5 package delivers better visual impact)
