XL-324SURUGW is a red–true green bicolor through-hole LED in F3 package (diameter 3.8 mm, height 5.3 mm, lead length 28 mm). It features diffused (light-diffusing) resin and a long-lead design for easy panel mounting or manual soldering, with a non-polar (bipolar) pin configuration that requires no polarity identification.
RoHS compliant with Moisture Sensitivity Level (MSL) 2. It offers low power consumption, long service life and high reliability, with a narrow 30° viewing angle (focused type). The true-green chip delivers a high brightness of up to 2500 mcd (typical), while the red chip reaches 900 mcd. The diffused resin effectively softens light and reduces glare, making it suitable for applications requiring high-brightness red–green bicolor indication with uniform light spot distribution.
Optical Characteristics
Red Chip
Dominant Wavelength (λd): 615~635 nm (typical peak: 625 nm, pure red)
Luminous Intensity (IV): 300~900 mcd (@20 mA, see datasheet for binning details)
True-Green Chip
Dominant Wavelength (λd): 515~535 nm (typical peak: 525 nm, pure true green)
Luminous Intensity (IV): 700~2500 mcd (@20 mA, typical: 2500 mcd, see datasheet for binning details)
Viewing Angle (2θ₁/₂): 30°
(Ultra-narrow angle with highly concentrated light output)
Resin Type: Diffused (frosted). Compared with clear resin, diffused resin achieves light diffusion to deliver softer and more uniform light spots, mitigating glare during direct viewing, while maintaining a narrow beam angle.
Electrical Parameters (Ta=25°C)
Red Chip
Maximum Power Dissipation: 50 mW
Maximum Continuous Forward Current: 20 mA
Forward Voltage: 1.8~2.4 V (@20 mA)
True-Green Chip
Maximum Power Dissipation: 70 mW
Maximum Continuous Forward Current: 20 mA
Forward Voltage: 2.8~3.4 V (@20 mA)
Maximum Pulse Peak Forward Current (IFP): 80 mA (Pulse width ≤0.1 ms, Duty cycle ≤1/10)
Reverse Current (IR): ≤10 μA (VR=5 V)
ESD Withstand Capacity: <1000 V (Human Body Model, HBM); ≤100 V (Machine Model, MM)
Structure & Reliability
Non-polar (bipolar) structure: Two LED chips connected in anti-parallel internally; no polarity identification required during mounting.
Operating Temperature: -20℃ ~ +85℃
Storage Temperature: -40℃ ~ +85℃
Soldering Conditions: Wave soldering at 240℃, ≤6 s; Manual soldering at 300℃, ≤3 s
Lead bending shall be conducted more than 2.0 mm away from the base of resin body with fixtures.
Passed reliability tests including 1000-hour operating life, high-temperature high-humidity test and temperature cycling test.
Additional Information
Available with brightness, voltage and wavelength binning to ensure consistent mass selection
Standard tape packaging with moisture-proof anti-static bags
28 mm lead length, suitable for panel mounting and manual soldering
