XL-324SURUGC is a red–true green bicolor through-hole LED in F3 package (diameter 3.8 mm, height 5.3 mm, lead length 28 mm). It features clear resin and a long-lead design for easy panel mounting or manual soldering, with a non-polar (bipolar) pin configuration that requires no polarity identification.
RoHS compliant with Moisture Sensitivity Level (MSL) 2. It offers low power consumption, long service life and high reliability, with a narrow 30° viewing angle (focused type). The true green chip delivers a high brightness of up to 2500 mcd (typical), while the red chip reaches 900 mcd. It is suitable for applications requiring high-brightness red–green bicolor indication with highly concentrated light output.
Optical Characteristics
Red Chip
Dominant Wavelength (λd): 620~630 nm (typical peak: 625 nm, pure red)
Luminous Intensity (IV): 300~900 mcd (@20 mA, see datasheet for binning details)
True-Green Chip
Dominant Wavelength (λd): 515~530 nm (typical peak: 525 nm, pure true green)
Luminous Intensity (IV): 700~2500 mcd (@20 mA, typical: 2500 mcd, see datasheet for binning details)
Viewing Angle (2θ₁/₂): 30°
(Ultra-narrow angle with highly concentrated light output)
Electrical Parameters (Ta=25°C)
Red Chip
Maximum Power Dissipation: 50 mW
Maximum Continuous Forward Current: 20 mA
Forward Voltage: 1.8~2.4 V (@20 mA)
True-Green Chip
Maximum Power Dissipation: 70 mW
Maximum Continuous Forward Current: 20 mA
Forward Voltage: 2.8~3.4 V (@20 mA)
Maximum Pulse Peak Forward Current (IFP): 80 mA (Pulse width ≤0.1 ms, Duty cycle ≤1/10)
Reverse Current (IR): ≤10 μA (VR=5 V)
ESD Withstand Capacity: <1000 V (Human Body Model, HBM); ≤100 V (Machine Model, MM). The rating is lower than SMD LEDs. Enhanced electrostatic protection is required during operation; extra care shall be taken for true-green chips fabricated with InGaN material.
Structure & Reliability
Non-polar (bipolar) structure: Two LED chips connected in anti-parallel internally; no polarity identification required during mounting.
Operating Temperature: -20℃ ~ +85℃
Storage Temperature: -40℃ ~ +85℃
Soldering Conditions: Wave soldering at 240℃, ≤6 s; Manual soldering at 300℃, ≤3 s
Lead bending must be performed more than 2.0 mm away from the base of resin body with fixtures.
Passed reliability tests including 1000-hour operating life, high-temperature high-humidity test and temperature cycling test.
Additional Information
Available with brightness, voltage and wavelength binning to ensure consistent mass selection
Standard tape packaging with moisture-proof anti-static bags
28 mm lead length, suitable for panel mounting and manual soldering
