XL-324SURUBW is a red-blue bicolor through-hole LED in F3 package (diameter 3.8 mm, height 5.3 mm, lead length 28 mm). It features diffused (light-diffusing) resin and a long-lead design for easy panel mounting or manual soldering, with a non-polar (bipolar) pin configuration that requires no polarity identification.
RoHS compliant with Moisture Sensitivity Level (MSL) 2. It offers low power consumption, long service life and high reliability, with a narrow 30° viewing angle (focused type). It provides red luminous intensity of 500 mcd and high blue luminous intensity of up to 1200 mcd. The diffused resin effectively softens light and reduces glare, making it suitable for applications requiring red-blue bicolor indication with uniform light spot distribution.
Optical Characteristics
Red Chip
Dominant Wavelength (λd): 620~640 nm (typical peak: 630 nm)
Luminous Intensity (IV): 100~500 mcd (@20 mA, see datasheet for binning details)
Blue Chip
Dominant Wavelength (λd): 450~470 nm (typical peak: 465 nm)
Luminous Intensity (IV): 400~1200 mcd (@20 mA, typical: 1200 mcd, see datasheet for binning details)
Viewing Angle (2θ₁/₂): 30°
(Ultra-narrow angle with highly concentrated light output)
Resin Type: Diffused (frosted). Compared with clear resin, diffused resin enables light diffusion to create softer and more uniform light spots, reducing glare during direct viewing while maintaining a narrow beam angle.
Electrical Parameters (Ta=25°C)
Red Chip
Maximum Power Dissipation: 50 mW
Maximum Continuous Forward Current: 20 mA
Forward Voltage: 1.8~2.4 V (@20 mA)
Blue Chip
Maximum Power Dissipation: 70 mW
Maximum Continuous Forward Current: 20 mA
Forward Voltage: 2.8~3.4 V (@20 mA)
Maximum Pulse Peak Forward Current (IFP): 80 mA (Pulse width ≤0.1 ms, Duty cycle ≤1/10)
Reverse Current (IR): ≤10 μA (VR=5 V)
ESD Withstand Capacity: <1000 V (Human Body Model, HBM); ≤100 V (Machine Model, MM). Its rating is lower than SMD LEDs, so enhanced ESD protection is required during handling.
Structure & Reliability
Non-polar (bipolar) structure: Two LED chips are internally connected in anti-parallel; no polarity identification required during mounting.
Operating Temperature: -20℃ ~ +85℃
Storage Temperature: -40℃ ~ +85℃
Soldering Conditions: Wave soldering at 240℃, ≤6 s; Manual soldering at 300℃, ≤3 s. Solder joints shall be more than 2.0 mm away from the base of resin body.
Lead bending must be performed more than 2.0 mm away from the base of resin body using fixtures.
Passed reliability tests including 1000-hour operating life, high-temperature high-humidity test and temperature cycling test (See Page 6 for details).
Additional Information
Available with brightness, voltage and wavelength binning to ensure consistent mass selection
Standard tape packaging with moisture-proof anti-static bags
28 mm lead length, suitable for panel mounting and manual soldering
