A national high-tech enterprise specializing in the research and development, production, and sales of light-emitting diode products
XL-324SURSYGC
XL-324SURSYGC

XL-324SURSYGC is an F3 through-hole bi-color LED (package diameter: 3.8 mm, height: 5.3 mm, lead length: 28 mm) with red-yellowish green output. It adopts clear resin and long-lead design for convenient panel mounting or manual soldering, featuring non-polar (bipolar) pin structure, which eliminates polarity identification during installation.

RoHS compliant; Moisture Sensitivity Level (MSL): Level 2 (superior to Level 3 of SMD LEDs). It features low power consumption, long service life and high reliability. With a narrow 30° viewing angle (focused beam type), it is ideal for applications requiring bi-color indication with concentrated light output.

Product Characteristics
Optical Characteristics

Red Chip

Dominant Wavelength (λd): 625~645 nm (typical peak: 635 nm, slightly orange-red compared with conventional red LEDs)

Luminous Intensity (IV): 50~400 mcd (@20 mA, see datasheet for binning details)

Yellowish-Green Chip

Dominant Wavelength (λd): 560~575 nm (typical peak: 570 nm)

Luminous Intensity (IV): 100~500 mcd (@20 mA, see datasheet for binning details)

Viewing Angle (2θ₁/₂): 30°

(Ultra-narrow angle with highly concentrated light, suitable for directional indication)


Electrical Parameters (Ta=25°C)

Red Chip

Maximum Power Dissipation: 50 mW

Maximum Continuous Forward Current: 20 mA

Forward Voltage: 1.8~2.4 V (@20 mA)

Yellowish-Green Chip

Maximum Power Dissipation: 50 mW

Maximum Continuous Forward Current: 20 mA

Forward Voltage: 1.8~2.4 V (@20 mA)

Maximum Pulse Peak Forward Current (IFP): 80 mA (Pulse width ≤0.1 ms, Duty cycle ≤1/10)

Reverse Current (IR): ≤10 μA (VR=5 V)

ESD Withstand Capacity: <1000 V (Human Body Model, HBM); ≤100 V (Machine Model, MM)

Non-polar (bipolar) structure: Two LED chips are internally connected in anti-parallel; no polarity distinction required during mounting.

Operating Temperature: -20℃ ~ +85℃

Storage Temperature: -40℃ ~ +85℃

Soldering Conditions: Wave soldering at 240℃, ≤6 s; Manual soldering at 300℃, ≤3 s

Lead bending must be performed more than 2.0 mm from the base of resin body using fixtures.

Passed reliability tests including 1000-hour operating life, high-temperature high-humidity test and temperature cycling test.


Additional Information

Available with brightness, voltage and wavelength binning to ensure consistent mass selection

Standard tape packaging with moisture-proof anti-static bag

28 mm lead length, suitable for panel mounting and manual soldering

Product Application
  • Backlight Modules: Indicator lights, signal backlighting

  • Automotive Interior: Dashboard indicators, key backlighting

  • Signal Indication: Equipment status indicators, alarm lamps (focused beam for long-distance visibility)

  • Smart Home Appliances: Status indicators, control panels

  • General Lighting: Decorative lighting, localized accent lighting