A national high-tech enterprise specializing in the research and development, production, and sales of light-emitting diode products
XL-DZ324SURUGWB/2
XL-DZ324SURUGWB/2

XL-DZ324SURUGWB2 is a red & true green bicolor LED module with a dual-hole mounting base (3mm hole diameter). It features diffused epoxy (light diffusion type) for soft light emission and adopts a **common anode** circuit configuration.

With external dimensions of 10.0×9.0×7.0mm, it integrates an F3 LED chip and can be easily mounted on panels or enclosures via the dual-hole base.

RoHS compliant, Moisture Sensitivity Level (MSL) 2, ESD immunity up to 2000V (Human Body Model). It features low power consumption, long lifespan and high reliability, with a 45° viewing angle. The true green chip delivers a high brightness of up to 2000mcd (typical).

Suitable for applications requiring high-brightness red-green bicolor indication with convenient panel mounting.

Product Characteristics
Optical Characteristics


Red Chip


Dominant Wavelength (λd): 620~630 nm (typical peak: 625 nm, pure red)


Luminous Intensity (IV): 500 mcd typical (@20 mA)


Spectral Line Half-width: 25 nm typical


True-Green Chip


Dominant Wavelength (λd): 515~530 nm (typical peak: 520 nm, pure true green)


Luminous Intensity (IV): 2000 mcd typical (@20 mA)


Spectral Line Half-width: 25 nm typical


Viewing Angle (2θ₁/₂): 45°


(The long-lead F3 variant provides a wider 30° beam, balancing directivity and coverage range)


Resin Type: Diffused (frosted). Delivers soft illumination, uniform light spot and reduced glare.


Electrical Parameters (Ta=25°C)


Red Chip


Maximum Power Dissipation: 50 mW


Maximum Continuous Forward Current: 20 mA


Forward Voltage: 1.8~2.4 V (@20 mA)



True-Green Chip


Maximum Power Dissipation: 70 mW


Maximum Continuous Forward Current: 20 mA


Forward Voltage: 2.6~3.4 V (@20 mA)


Maximum Pulse Peak Forward Current (IFP): 80 mA (Pulse width ≤0.1 ms, Duty cycle ≤1/10)


Maximum Reverse Voltage (VR): 5 V


Reverse Current (IR): ≤10 μA (VR=5 V)


ESD Withstand Voltage: 2000 V (HBM), significantly superior to <1000 V of long-lead non-polar series



Structure & Reliability


Common anode configuration: two LED chips share one common anode pin with independent cathode control.


Dual-hole mounting base: Can be secured to panels with M3 screws or fasteners without extra mounting brackets.


Operating Temperature: -35℃ ~ +85℃ (improved from the -20℃ lower limit of long-lead series)


Storage Temperature: -40℃ ~ +85℃


Soldering Conditions: Wave soldering at 240℃, ≤6 s; Manual soldering at 300℃, ≤3 s. Solder joints shall be ≥2.0 mm away from the bottom of resin body.


Passed reliability tests including 1000-hour operating life, high-temperature high-humidity test and temperature cycling test (See Page 6 for details).



Additional Information


Packaged in EIA standard tape & moisture-proof anti-static bags


Available with brightness, voltage and wavelength binning to ensure consistent mass selection


Moderate lead length, suitable for soldering or connector plug-in connection

Product Application

IoT: Status indicator lights for smart devices


Medical Equipment: Panel status indication for instruments


Converters & Power Supplies: Operating status indication


Storage Servers & Communication Equipment: Network status and hard disk activity indication


Status Indicators: Indicator lamps for various industrial equipment and dashboards


Electronic Test Instruments: Signal status and alarm indication