XL-DZ324SURUGWA2 is a red true-green bi-color LED assembly equipped with a dual-hole mounting base (3 mm hole diameter). It adopts diffused resin (light-diffusion type) for soft light output and features a common cathode circuit configuration. External dimensions: 10.0×9.0×7.0 mm. Built-in F3 LED chips. The dual-hole mounting base enables convenient installation onto panels or enclosures.
RoHS compliant; Moisture Sensitivity Level (MSL): Level 2; ESD withstand capacity up to 2000 V (Human Body Model, HBM). It delivers low power consumption, long service life and high reliability with a viewing angle of 45°. The true-green chip achieves luminous intensity up to 2000 mcd (typical). Ideal for applications requiring high-brightness red & true-green bi-color indication and easy panel mounting.
Optical Characteristics
Red Chip
Dominant Wavelength (λd): 620~630 nm (typical peak: 625 nm, pure red)
Luminous Intensity (IV): 500 mcd typical (@20 mA)
Spectral Line Half-width: 25 nm typical
True-Green Chip
Dominant Wavelength (λd): 515~530 nm (typical peak: 520 nm, pure true green)
Luminous Intensity (IV): 2000 mcd typical (@20 mA, significantly higher than 200 mcd of red-yellowish green variant)
Spectral Line Half-width: 25 nm typical
Viewing Angle (2θ₁/₂): 45°
(The long-lead F3 variant provides a wider 30° beam, balancing directivity and coverage range)
Resin Type: Diffused (frosted). Delivers soft illumination, uniform light spot and reduced glare.
Electrical Parameters (Ta=25°C)
Red Chip
Maximum Power Dissipation: 50 mW
Maximum Continuous Forward Current: 20 mA
Forward Voltage: 1.8~2.4 V (@20 mA)
True-Green Chip
Maximum Power Dissipation: 70 mW
Maximum Continuous Forward Current: 20 mA
Forward Voltage: 2.6~3.4 V (@20 mA)
Maximum Pulse Peak Forward Current (IFP): 80 mA (Pulse width ≤0.1 ms, Duty cycle ≤1/10)
Maximum Reverse Voltage (VR): 5 V
Reverse Current (IR): ≤10 μA (VR=5 V)
ESD Withstand Voltage: 2000 V (HBM), significantly superior to <1000 V of long-lead non-polar series
Structure & Reliability
Common cathode configuration: two LED chips share one common cathode pin with independent anode control.
Dual-hole mounting base: Can be secured to panels with M3 screws or fasteners without extra mounting brackets.
Operating Temperature: -35℃ ~ +85℃ (improved from the -20℃ lower limit of long-lead series)
Storage Temperature: -40℃ ~ +85℃
Soldering Conditions: Wave soldering at 240℃, ≤6 s; Manual soldering at 300℃, ≤3 s. Solder joints shall be ≥2.0 mm away from the bottom of resin body.
Passed reliability tests including 1000-hour operating life, high-temperature high-humidity test and temperature cycling test (See Page 6 for details).
Additional Information
Packaged in EIA standard tape & moisture-proof anti-static bags
Available with brightness, voltage and wavelength binning to ensure consistent mass selection
Moderate lead length, suitable for soldering or connector plug-in connection
IoT: Status indicator lights for smart devices
Medical Equipment: Panel status indication for instruments
Converters & Power Supplies: Operating status indication
Storage Servers & Communication Equipment: Network status and hard disk activity indication
Status Indicators: Indicator lamps for various industrial equipment and dashboards
Electronic Test Instruments: Signal status and alarm indication
