A national high-tech enterprise specializing in the research and development, production, and sales of light-emitting diode products
XL-DZ324SURSYGWA/2
XL-DZ324SURSYGWA/2

XL-DZ324SURSYGWA2 is a bi-color (red and yellowish-green) LED assembly featuring a dual-hole mounting base (3mm aperture) for easy panel or enclosure installation. The frosted (light-diffusing) epoxy provides soft, uniform illumination with reduced glare. It adopts a common-cathode circuit configuration. With external dimensions of 10.0×9.0×7.0mm and built-in F3 LED chips, this component offers reliable fixation through its dual-hole mount without requiring additional brackets. RoHS compliant, with moisture sensitivity level (MSL) 2 and ESD withstand voltage up to 2000V (HBM), it delivers low power consumption, long lifespan, and high reliability. The 45° viewing angle makes it ideal for applications requiring soft bi-color indication and convenient panel mounting.

Product Characteristics

Optical Characteristics

Red Chip

Dominant Wavelength (λd): 620~630 nm (typical peak: 625 nm, pure red)

Luminous Intensity (IV): 500 mcd typical (@20 mA)

Spectral Line Half-width: 25 nm typical

Yellowish-Green Chip

Dominant Wavelength (λd): 565~575 nm (typical peak: 560 nm, standard green/yellowish green)

Luminous Intensity (IV): 200 mcd typical (@20 mA)

Spectral Line Half-width: 25 nm typical

Viewing Angle (2θ₁/₂): 45°

(The long-lead F3 version features a wider 30° beam, balancing directivity and coverage range)

Resin Type: Diffused (frosted). Delivers soft illumination and uniform light spot with reduced glare.

Electrical Parameters (Ta=25°C)

Red Chip

Maximum Power Dissipation: 50 mW

Maximum Continuous Forward Current: 20 mA

Forward Voltage: 1.8~2.4 V (@20 mA)

Yellowish-Green Chip

Maximum Power Dissipation: 50 mW

Maximum Continuous Forward Current: 20 mA

Forward Voltage: 1.8~2.4 V (@20 mA)

Maximum Pulse Peak Forward Current (IFP): 80 mA (Pulse width ≤0.1 ms, Duty cycle ≤1/10)

Maximum Reverse Voltage (VR): 5 V

Reverse Current (IR): ≤10 μA (VR=5 V)

ESD Withstand Voltage: 2000 V (HBM), noticeably superior to <1000 V of long-lead non-polar series

Structure & Reliability

Common cathode configuration: two chips share one cathode pin with independent anode control.

Dual-hole mounting base: Can be fixed to panels via M3 screws or fasteners without extra brackets.

Operating Temperature: -35℃ ~ +85℃ (improved from -20℃ lower limit of long-lead series)

Storage Temperature: -40℃ ~ +85℃

Soldering Conditions: Wave soldering 240℃, ≤6 s; Manual soldering 300℃, ≤3 s. Soldering points shall be ≥2.0 mm away from the bottom of resin body.

Passed reliability tests including 1000-hour operating life, high-temperature high-humidity test and temperature cycling test (See Page 6 for details).

Others

Packaged in EIA standard tape & moisture-proof anti-static bags

Available with brightness, voltage and wavelength binning for consistent mass selection

Moderate lead length, compatible with soldering or connector plug-in connection

Product Application
IoT: Status indicator lights for smart devices

Medical Equipment: Panel status indication for instruments

Converters & Power Supplies: Operating status indication

Storage Servers & Communication Equipment: Network status and hard disk activity indication

Status Indicators: Indicator lamps for various industrial equipment and dashboards

Electronic Test Instruments: Signal status and alarm indication